Responsibilities:

• Perform design of experiments (DOE) to launch new models and optimize SMT process yield.
• Optimize/configure processes and equipment for building surface mount electronics assemblies.
• Lead efforts to uncover root-cause and develop a permanent resolution on issues found during pre-production.
• Specify equipment and process requirements for PCBA build processes.
• Perform process development and validation on new models in extremely aggressive timelines.

Qualifications:

• Bachelor's degree in an engineering discipline.
• Professional experience working in SMT or PCBA process/manufacturing engineering.
• Hands on experience with stencil print, SPI, pick & place, reflow, AOI, ICT, x-ray inspection, underfill and staking processes.
• Proven experience in dynamic NPI environment and transition to full scale production.
• Experience with high volume commercial, industrial or consumer grade electronics manufacturing.